簡易檢索 / 詳目顯示

回結果列表
研究生： 賴運正
Yun-Cheng Lai
論文名稱： 精微超硬研削工具線上開發與應用
On-line development and application of the micro super grinding tools
指導教授： 陳順同
Chen, Shun-Tong
學位類別： 碩士
Master
系所名稱： 機電工程學系
Department of Mechatronic Engineering
論文出版年： 2010
畢業學年度： 98
語文別： 中文
論文頁數： 96
中文關鍵詞： CBN陣列式輪刀 、微型鑽石磨棒 、微放電成型 、電化學複合沉積
英文關鍵詞： CBN wheel tool array, rod-shaped diamond grinding tool, micro EDT, electrochemical co-deposition
論文種類： 學術論文
相關次數： 點閱：227  下載：12 
分享至:
查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報
  •  上一筆

    • 本研究旨在開發超硬微型研磨工具，提供微型模具的線上精研加工，並以低成本及陣列式開發，專用於脆性材料如細胞檢測之載玻片微溝加工、陶瓷光纖接頭的去角加工或模具材料如NAK80模具鋼的微溝加工等。研究中，提出一種複合製造技術，結合『精密複合沉積』與『微型線切割放電加工』，將粒徑0-2µm的鑽石或立方晶氮化硼(CBN)顆粒以電化學複合沉積方式沉積於基材上，而成特定形狀的微細鑽石(或立方晶氮化硼)工具。微細工具粗胚以高速主軸夾持，再以線切割放電加工方式，將之線上削正成型，完成的精微研削工具不拆卸，直接透由CNC刀具路徑移位至工件處，進行微細研削加工。由於本技術採線上複合式製造，故刀具沒有定位問題，可獲致製程之高同心度與高定位精度。刀具具『精微』與『超硬』外，製程所需費用低、環保、成型速度快、加工精度高，加工的工件更能獲致『精密快速』效果。

    The major aim of the thesis is to develop the micro cubic boron nitride (CBN) wheel tool array and rod-shaped diamond grinding tool for generating the micro grooves array on the optical glass and mould steel of NAK80, and chamfering at the edge of micro ceramic ferrule, respectively. A hybrid fabrication technique combining precise co-deposition with micro w-EDT is used to the process development. The tool blank is first fabricated through micro EDM and composite electroforming process so that the super abrasives, which includes cubic boron nitride (CBN) and diamonds with grain size of 0-2 µm, are uniform deposited onto the cylindrical substrate that made of aluminum alloy or tungsten carbide for producing a miniature multilayered grinding tool. Nickel, diamond and CBN play the role of binder and cutter, respectively. Some fabrication strategies including the partition plate for improving the convection in the electroforming solution, a miniature funnel mould enables the abrasives to converge toward the cathode to increase their deposition probability on the substrate, are designed and proposed. The dispersion of abrasive grains and displacement of nickel ions are noticeably made better. A non-continuous substrate design is proved that the current crowding effect is able to be restricted validly, thereby improving their distribution on the substrate surface. The finished wheel tool blank is clamped on a high speed spindle and formed into disk-shaped tool array with 10-µm for the thickness of each piece by means of micro w-EDT process. The miniature diamond grinding tool usable with the outside diameter of 100-µm for the precise micro grinding of miniature parts is also presented. They are individually directly used in grinding the workpiece using the ‘high-speed and fast-shallow grinding’ technique, with which a very high grinding velocity and very shallow grinding depth are employed, is used for precisely machining the microgrooves. The microgrooves with a checkerboard-like layout on optical glass and NAK80 mould steel are successfully fabricated for the application of cells counter. Also, a micro ZrO2 ceramic ferrule is finely chamfered at the edge of the inner hole by the developed tapered grinding tool so that the fiber easily passes through it. High dimensional and geometrical accuracy can be achieved with this hybrid technique. Further, the proposed technique is rapid, cost effective, environment friendly and easily controllable.

    中文摘要 I 英文摘要 II 目錄 III 圖目錄 VII 表目錄 XI 符號說明 XII 第一章 緒論 1 1-1 前言 1 1-2 研究動機 2 1-3 研究目的 2 1-4 研究方法 3 1-5 文獻回顧 4 1-5-1 微溝槽加工應用文獻回顧 4 1-5-2 精微內孔加工應用文獻回顧 9 第二章 精微超硬研削工具開發之原理應用 12 2-1 鋅置換化學反應 12 2-1-1 鋅置換理論 12 2-1-2 鋅置換處理 13 2-2 電化學複合沉積原理 14 2-2-1 電鍍原理與應用 14 2-2-2 電化學複合沉積原理 16 2-3 放電加工原理 17 2-3-1 微放電加工原理 18 2-3-2 線式放電研削原理 19 2-4 高速快淺研削原理 19 2-4-1 研削基本原理 19 2-4-2 磨削之材料移除機制 21 2-4-3 高速快淺研削應用 22 第三章 實驗設備設計 24 3-1 立方晶氮化硼輪刀胚料之電化學複合沉積槽設計 24 3-1-1 基材旋轉機構之設計 25 3-1-2 漏斗式模具設計(微細盤狀工具) 26 3-2 鑽石磨棒的電化學複合沉積槽設計 26 3-2-1 鑄液對流設計 26 3-2-2漏斗式模具設計(微細柱狀工具) 27 3-3 電化學複合沉積機構週邊硬體 29 3-3-1 槽體溫控設計 29 3-3-2 精密電源供應器 30 3-4 複合式CNC微型加工機應用 31 3-5 高速主軸應用 31 3-6 線切割放電加工機應用 33 3-7 實驗所用之量測儀器設備 34 3-7-1 工具顯微鏡 34 3-7-2 掃描式電子顯微鏡 34 3-7-3 白光干涉儀 35 3-7-4 3D雷射掃描顯微鏡 35 3-8 實驗材料 36 3-8-1 微型研削工具基材 36 3-8-2 微型研削工具之磨粒選用 37 3-8-3 銅線電極材料 38 3-8-4 被研削材—氧化鋯陶瓷 39 3-8-5 被研削材—光學玻璃 39 3-8-6 被研削材—NAK80模具鋼 40 第四章 實驗方法 41 4-1 微型陣列式CBN輪刀開發 42 4-1-1 陣列式輪刀之高精密心軸設計 42 4-1-2 臥式同心滾鍍實驗 43 (1) 滾鍍槽防漏設計 43 (2) 磨粒聚合實驗 43 (3) 磨粒均佈率與沉積時間關係 45 4-1-3 磨粒沉積量影響因子 47 (1) 單位容積磨粒含量對沉積量的影響 48 (2) 鑄液流速對磨粒沉積量的影響 50 (3) 主軸轉速對磨粒沉降量的影響 51 (4) 結果與討論 52 4-1-4 陣列式CBN圓盤胚料放電修整實驗 53 (1) 輪刀胚料同心放電修整 54 (2) 放電能量參數選用 56 (3) 陣列式CBN輪刀成型修整與放電間隙關係 57 (4) 結果與討論 58 4-2 微型鑽石磨棒開發 58 4-2-1 刀具基材成型加工 59 4-2-2 陽極形狀對微細磨棒成型之影響 61 4-2-3 磨粒沉積量影響 62 (1) 陰極最佳鑄區實驗 62 (2) 陣列式漏斗模具設計與實驗 63 4-2-4 各式微細磨棒製作與驗證 65 4-2-5 結果與討論 66 第五章 精微超硬研削工具應用與驗證 67 5-1 微型陣列式CBN輪刀應用 67 5-1-1 光學玻璃微溝研削加工 67 (A)、研削深度對切割道品質的影響 68 (B)、切刃厚度對切割道長度的影響 73 (C)、討論 74 5-1-2 NAK80模具鋼微溝研削加工 74 (A)、輪刀鍍層厚度對微溝寬度的影響 75 (B)、NAK80微溝表粗 77 5-1-3 陣列式CBN輪刀之刀具壽命探討 79 (A)、研削光學玻璃陣列細溝之刀具壽命 80 (B)、研削NAK80陣列細溝之刀具壽命 81 5-2 微型鑽石磨棒應用 83 5-2-1 精密陶瓷去角研削加工 84 5-2-2 表面粗糙度探討 85 第六章 結論 86 6-1 結果 86 6-2 未來展望 89 參考文獻 91 個人簡歷 95 附註: 已發表論文 96

    1.謝慶堂等人，工業材料雜誌，193期，pp. 175，民92。
    2.詹前疆，產業調查與技術，微機電系統，pp. 87-102，民90。
    3.J. S. Lee, D. W. Lee, Y. H. Jung, W. S. Chung, "Brittle–ductile transition in the diamond cutting of glasses with the aid of ultrasonic vibration", Journal of Materials Processing Technology, Vol. 121, pp. 243-251, 2002
    4.K. Matsumaru, A. Takata, K. Ishizaki, "Advanced thin dicing blade for sapphire substrate", Science and Technology of Advanced Materials, Vol. 6, pp. 120-122, 2005
    5.I. H. Cho, S. C. Jeong, J. M. Park, H. D. Jeong, "The application of micro-groove machining for the mold of PDP barrier ribs", Journal of Materials Processing Technology, Vol. 113, pp. 355-359, 2001
    6.S. B. Lee, Y. Tani, T. Enomoto, H. Sato, "Development of a dicing blade with photopolymerizable resins for improving machinability", CIRP Annals Manufacturing Technology, Vol. 54, pp. 293-296, 2005
    7.J. S. Lee, D. W. Lee, Y. H. Jung, W. S. Chung, "Brittle–ductile transition in the diamond cutting of glasses with the aid of ultrasonic vibration", Journal of Materials Processing Technology, Vol.121, pp.243–251, 2002
    8.楊啟榮，強玲英，黃奇聲，微系統LIGA製程之精密電鑄技術，科儀新知，pp. 22，民89。
    9.J. Y. Cheng, C. W. Wei, K. H. Hsu, T. H. Young, Direct-write laser micromachining and universal surface modification of PMMA for device development, Sensors and Actuators B: Chemical Vol. 99, pp.186-196, 2004
    10.Th. Schaller, L. Bohn, J. Mayer, K. Schubert, "Microstructure Grooves With A Width of Less than 50μm Cut With Ground Metal Micro End Mills", Precision Engineering, Vol. 23, pp. 229-235, 1999
    11.C. L. Kuo, J. D. Huang, “Fabrication of series-pattern micro multi-disk and its application to cut micro slit with width as low 10μm”, IEEE/ASME International Conference on Advanced Manufacturing Technologies and Education, Vol.27, pp.154-156, 2002
    12.陳?東，以線放電加工在微細槽模具製程探討，博士論文，國立中興大學，機械工程學系，2004，pp.69-79
    13.S. Nikumba, Q. Chen, C. Li, H. Reshef, H. Y. Zheng, H. Qiu, D. Low, "Precision glass machining, drilling and profile cutting by short pulse lasers", ELVEIER, pp. 216-221, 2005
    14.B. H. Kim, C. W. Na, Y. S. Lee, D. K. Choi, C. N. Chu, "Micro Electrochemical Machining of 3D Micro Structure Using Dilute Sulfuric Acid", CIRP Annals - Manufacturing Technology, Vol. 54, pp. 191-194, 2005
    15.G. D. Kim, B. G. Loh, "An ultrasonic elliptical vibration cutting device for micro V-groove machining: Kinematical analysis and micro V-groove machining characteristics", Journal of Materials Processing Technology, Vol. 190, pp. 181-188, 2007
    16.C. Evans, "Cryogenic Diamond Turning of Stainless Steel", Annals of the CIRP, Vol.40, pp.571-575, 1991
    17.S. Sano, W. Pan, M. Iwai, S. Ninomiya, T. Uematsu, K. Suzuki, "Hybrid processing of EDM and grinding with an ED-T-formed PCD tool", ISAAT, Dearborn, Michigan, USA, 2007
    18.S. T. Chen, C. C. Liu, Y. C. Lai, Y. L. Pai, "Development of Micro Formed Grinding Tool using Compound Processes", Proceedings of the 24th National Conference on Mechanical Engineering, Chung-Li, Taiwan, pp. 4687-4692, 2007
    19.J. C. Hung, W. C. Wu, B. H. Yan, F. Y. Huang, K. L.Wu, "Fabrication of a micro-tool in micro-EDM combined with co-deposited Ni–SiC composites for micro-hole machining", J. Micromech. Microeng, Vol. 17, pp. 763-774, 2007
    20.S. T. Chen, M. C. Yeh, "Development and application of a micro-honing-tool", Advanced Materials Research, Vols. 76-78, pp. 189-194, 2009
    21.J. C. Aurich, J. Engmann, G. M. Schueler, R. Haberland, "Micro grinding tool for manufacture of complex structures in brittle materials", CIRP Annals - Manufacturing Technology, Vol. 58, pp. 311-314, 2009
    22.Hewitson, "Eastman Kodak Co". Vol. 1, pp. 627-900, 1927
    23.Straumanis, M. E. Brakss, J. Electrochem. Soc., pp. 95-98, 1949
    24.Streicher, J. Electrochem. Soc., pp. 96-170, 1949
    25.Petrocelli, J. Electrochem. Soc., pp. 98-183, 1951
    26.呂政?編，電鍍學，世一書局，pp. 10，民82。
    27.蘇癸陽編，實用電鍍理論與實際，復文出版社，pp. 96-98，民88。
    28.陳順同、林憲志，超薄型鑽石輪刀開發與光學玻璃細溝加工研究，模具暨應用產業技術論文發表會論文集，南港世貿館，pp. 281-289，2009。
    29.楊啟榮，微機電製程之精密電鑄技術。http://mems.ie.ntnu.edu.tw
    30.張義和、徐敬添、鄒淑貞、陳守一、時國誠，微奈米粉體用高分子型分散劑，化工技術，第十一卷，第十一期，pp. 118-125，民92。
    31.廖運炫，放電加工之發展趨勢與研究現況，機械月刊，Vol. 301，pp. 374-387。
    32.Charmilles technologies ROBOFIL 300, pp. 1.1.4-1.1.5, 1993
    33.Bilbao, SPAIN, Proceedings of the 13th International Symposium for electromachining isem XIII, May 9th-11th, pp.4, 2001
    34.機械技術雜誌編輯部，二十一世紀的顯學微機電系統(四)-微放電精密加工，機械技術雜誌，pp. 220-222，民89。
    35.Masuzawa T., Fujino M., "Wire Electro Discharge Grinding for Micro Machining", CIRP, Vol. 34, pp.431-434, 1985
    36.庄司克雄, 超精密加工?非球面加工, NTS, ISBN4-8043-059-X C3050, 民93。
    37.James M. Gere, Stephen P. Timoshenko, Mechanics of Materials, Boston PWS, H4, 1984
    38.張義和、徐敬添、鄒淑貞、陳守一、時國誠，微奈米粉體用高分子型分散劑，化工技術，第十一卷，第十一期，pp. 118-125，民92。
    39.松祿文化機械群編譯，精密鑽石工具，松祿文化事業，pp. 130，民91。
    40.王秦生，超硬材料電鍍制品，中國磨料磨具工業公司，pp. 11，民89。
    41.C. H. Huang, "Hydrolysis of Sulfamate Ion in Nickel Sulfamate Solution", Plating and Surface Finishing, pp. 64-68, 1994
    42.Davis, J. R., "ASM Specialty Handbook, Tool Materials", ASM International, Materials Park, OH 440730002, pp.88, 1995
    43.Y. Chen, L. C. Zhang, J. A. Arsecularatne, "Polishing of polycrystalline diamond by the technique of dynamic friction. Part 2: Material removal mechanism", International Journal of Machine Tools & Manufacture, pp. 1615-1624, 2007
    44.宋健民，超硬材料，全華科技圖書股份有限公司，pp. 5-2，民89。
    45.千盟模具有限公司，http://www.taissic.com/uwish/front/bin/home.phtml
    46.郭鴻賓，玻璃工程，徐氏基金會出版，pp. 6-9，民59。
    47.天文大同特殊鋼股份有限公司，http://www.daidosteel.com.tw
    48.Y. S. Liao, S. T. Chen, Development of a high precision tabletop versatile CNC wire-EDM for making intricate- micro parts, Journal of Micromechanics and Microengineering, P246-249, 2005
    49.林憲志，厚度10μm鑽石輪刀開發與光學玻璃切溝研究，國立台灣師範大學工業教育學系，博士論文。
    50.Milton C. Shaw, "Metal cutting principles", pp. 179-184, 2005
    51.Huang H, Chen W K, Yin L, Xiong Z, Liu Y C and Teo P L, "Micro/meso ultra precision grinding of fibre optic connectors Precis", Vol. 28, pp. 95-105, 2004

    下載圖示
    QR CODE