研究生: |
黃聘聘 Huang, Pin-Pin |
---|---|
論文名稱: |
以覆蓋氣-液-固相方法合成釩摻雜之二硫化鉬薄膜 A New Vanadium Doping Strategy of MoS2 through Capping-Vapor-Liquid-Solid |
指導教授: |
陳貴賢
Chen, Kuei-Hsien 林麗瓊 Chen, Li-Chyong |
口試委員: | 陳貴賢 林麗瓊 陳家俊 邱博文 |
口試日期: | 2021/07/21 |
學位類別: |
碩士 Master |
系所名稱: |
化學系 Department of Chemistry |
論文出版年: | 2021 |
畢業學年度: | 109 |
語文別: | 中文 |
論文頁數: | 93 |
中文關鍵詞: | 二硫化鉬 、釩摻雜二硫化鉬 、氣-液-固相 、大面積薄膜 |
英文關鍵詞: | MoS2 thin film, V-doped MoS2, vapor-liquid-solid, centimeter-scale |
研究方法: | 實驗設計法 |
DOI URL: | http://doi.org/10.6345/NTNU202100784 |
論文種類: | 學術論文 |
相關次數: | 點閱:130 下載:15 |
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二維材料近年來被視為下一世代的半導體材料,有別於三維材料,
二維材料能以單原子層結構穩定存在,並且具備良好的物性與電性,
可縮小現有的場效電晶體體積,提高晶片效能;除此之外,二維材料
也能做為新穎的替代能源材料,將二氧化碳轉化成碳氫化合物,並且
可透過釩摻雜來提高催化效率,期望改善全球暖化問題。
本實驗研究的二維材料為屬於過渡金屬二硫族化合物(TMDCs)中
的二硫化鉬,並著重於合成釩摻雜之二硫化鉬的方法,二硫化鉬不僅
可應用於光電元件,亦可做為觸媒材料,若想將二硫化鉬應用於工業
上,則需要合成大面積且連續均勻的薄膜,故此研究使用創新的合成
方法: 覆蓋氣-液-固態方法來製備釩參雜之二硫化鉬薄膜,首先在矽
基板上沉積四層前驅物薄膜,依序為:三氧化鉬、五氧化二釩、氟化鈉、
二氧化矽薄膜,二氧化矽薄膜做為覆蓋層及擴散膜,防止氧化釩蒸發
消失跟控制氣體硫的擴散,對於釩摻雜是重要的一環,若沒有二氧化
矽覆蓋層,釩將無法成功的摻雜進二硫化鉬中;在硫化過程中氧化鉬、
氧化釩與氟化鈉先反應形成鹽類液體後,氣態硫再穿過二氧化矽覆蓋
層來與鹽類液體反應,最後過飽和析出釩摻雜二硫化鉬薄膜;此方法
因牽涉到鹽類液態反應,因此能合成高摻雜濃度的二硫化鉬薄膜。
Transition metal dichalcogenides (TMDs) have attracted people’s
attention due to their outstanding physical properties. Molybdenum
disulfide (MoS 2 ) thin film has been particularly found unique applications
in catalysis, optoelectronics, transistors, and energy storage. These
applications demand a large-scale synthesis of MoS 2 thin film with uniform
thickness and high crystallinity. Besides, dopants in two-dimensional
dichalcogenides have a significant role in affecting electronic, mechanical,
and interfacial properties. Controllable doping is desired for the intentional
modification of such properties to enhance performance. Vanadium-doing
could enhance MoS 2 conductivity and carrier concentration so that it can
improve catalytic activity. In this report, a new capping vapor-liquid-solid
(VLS) synthesis has been developed. Depositing MoO 3 , V 2 O 5 , NaF and
SiO 2 on SiO 2 /Si wafer sequentially as a 4-layer precursor. Herein, SiO 2 acts
as capping layer and diffusion membrane, which is critical for V-doping.
During sulfurization, MoO 3 , V 2 O 5 and NaF will form Mo/V/Na salt liquid
first. Then sulfur will diffuse through capping SiO 2 layer and dissolve in
Na salt liquid. Finally, V-MoS 2 will oversaturated on the substrate. After
that, HF etching process is used to remove capping SiO 2 layer and V-MoS 2
will show on the centimeter-scale wafer.
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