本研究利用phthalimide經硝化反應生成4-nitro-phthalimide
(NPH)、以及由氫化反應生成4-amino-phthalimide(APH)，為具有醯亞胺基結構的化合物並以此當作環氧樹脂之硬化劑，並經由IR、NMR、MS、EA等分析儀器確認其結構。以APH與商用硬化劑DDS、DDM使含磷環氧樹脂〔其由9,10-Dihydro-9-oxa-10-phosphaphenthrene (DOPO)和環氧樹脂(CNE，Cresol Novolac Epoxy Resin)反應而成〕硬化後製成試片(代號APHE、DDSE、DDME)，經由DMA、TGA、DSC、阻抗分析、LOI等分析測試硬化後樹脂的熱學性質、機械性質、難燃性質與介電性質。
硬化的樹脂試片經過阻抗分析測試，在介電常數上的結果顯示APHE(3.08)＜DDSE(4.03)＜DDME(4.97)，乃因APH具有醯亞胺結構，降低了樹脂分子間的交互作用，所以得到硬化樹脂的介電常數值最低，且當APH添加比例增加時，因增加了樹脂的交聯密度，使得其值愈低；由TGA分析得到在氮氣與空氣氣氛下5%和10%硬化樹脂的裂解溫度由高到低依序為APHE＞DDSE＞DDME，與DMA分析得到硬化樹脂的玻璃轉移溫度由高到低亦為APHE(140.97 ℃)＞DDSE(133.25 ℃)＞DDME(71.74 ℃)，此因APH具有較剛硬的醯亞胺結構；在耐燃性質上，因為樹脂具有含磷的DOPO基團，所以各硬化樹脂LOI的測試值皆大於26，故顯示皆有不錯的阻燃特性。
此外，三種硬化劑(APH、DDS、DDM)與含磷環氧樹脂的硬化行為與硬化動力學分別經由DSC測試分析，並利用Kissinger與Ozawa方法計算，結果顯示促使環氧樹脂硬化的反應活化能，由低至高依序為DDME(50.04 KJ/mol)＜DDSE(62.92 KJ/mol)＜APHE(74.40 KJ/mol)。

This research has synthesized an imide-containing compound , 4-amino-phthalimide (APH) as a curing agent for epoxy resins. APH was synthesized from phthalimide by a nitration and a hydrogenation reaction. The structure of synthesized compound was characterized and confirmed by FTIR, 1H-NMR, 13C-NMR, MASS and EA spectra. The epoxy resins, i.e., CNE with DOPO cured by APH, DDM and DDS (APHE, DDME, DDSE). Both DDM and DDS are commercial curing agents. The mechanical, thermal, dielectric and flame retardant properties of the cured epoxy resins were evaluated and compared by DMA, TGA, DEA and LOI tests.
The impendence result shows that APHE exhibits the lowest dielectric constant followed by DDSE and DDME. This is because that APH contains imide groups, which reduce the interactions between polymer molecules themselves. The TGA result shows that APHE has higher degradation temperature and glass transition temperature than the other two cured resins, for the former’s chemical structure is more rigid. The LOI values of all tested samples are about 35, and are greater than 26, suggesting that all cured sample have good flame retardant property.
In addition, the curing behavior of each curing agent (APH, DDM, DDS) is investigated by DSC measurements. The result indicates that DDME requires the lowest reaction activation energy to cure the epoxy resin, followed by DDSE, and APHE.

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