本實驗對不同厚度的Ni/√3×√3-Ag/Si(111)直接升溫，做成分及磁性的分析，發現在特定溫度範圍內會形成穩定態，且隨著Ni厚度增加，形成穩定態的發生溫度會延後，推測熱穩定度隨著Ni的厚度增加而提高。接著我們分別對12 ML Ni/√3×√3-Ag/Si(111)做直接升溫及間接升溫的比較，間接升溫較直接升溫延後200 K消磁，可知直接升溫有提高200 K之物理影響。再來有兩種製程，第一種是直接13及15 ML Ni/√3×√3-Ag/Si(111)上成長Ag，第二種是先將13及15 ML Ni/√3×√3-Ag/Si(111)間接升溫至550 K後才成長Ag，我們發現飽和磁化量及殘磁幾乎不隨著Ag厚度增加而改變，而第一種製程矯頑力不隨之改變，其原因為未先升 溫Ni排列不整齊，故蓋Ag不會增加表面缺陷，不會使矯頑力上升；但第二種製程隨著上層蓋Ag厚度增加，矯頑力會增加，其原因為先升溫可使上層Ni排列較整齊，蓋Ag會使表面缺陷增加，故矯頑力會上升。最後我們將所有樣品間接升溫，發現隨著退火溫度上升，飽和磁化量及殘磁在600 K前幾乎不變，其原因為上層蓋Ag會保護Ni/√3×√3-Ag/Si(111)使之結構不易被破壞；而溫度達550 K以上時，我們發現15 ML樣品的矯頑力會上升且出現峰值，推測此時Ni大量向上層Ag擴散導致樣品缺陷增加，使矯頑力最大。

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