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研究生： 黃暐仁
Wei-Ren Huang
論文名稱： 大負斜角精微聚晶鑽石球型研削工具開發與微小碳化鎢模仁加工研究
Development of micro BD-PCD ball grinding tool with a large negative-back-rake-angle and research of micro tungsten carbide die machining
指導教授： 陳順同
Chen, Shun-Tong
學位類別： 碩士
Master
系所名稱： 機電工程學系
Department of Mechatronic Engineering
論文出版年： 2012
畢業學年度： 100
語文別： 中文
論文頁數： 108
中文關鍵詞： 高剛性桌上型工具機 、精微聚晶鑽石球型研削工具 、碳化鎢模仁陣列
英文關鍵詞： High rigidity tabletop machine tool, micro BD-PCD ball grinding, tungsten carbide die array
論文種類： 學術論文
相關次數： 點閱：682  下載：6 
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    • 本研究旨在開發、設計及製造「大負斜角的BD-PCD球型研削工具」，並應用高剛性桌上型工具機，進行微小碳化鎢模仁的研削創成加工研究。研究之初，以粒徑10-15 µm的BD-PCD片料，利用高週波銀焊技術，將其焊至碳化鎢刀柄上。聚晶鑽石刀具粗胚再以旋轉式線切割放電加工法，成形精微含硼聚晶鑽石球型研削工具。為避免材料移除過程中，研削工具與碳化鎢模仁因高速研削與擠壓，而引發研削刃與模仁的脆性破壞，本研究提出一種「大負後斜角設計」的概念，使球型研削工具刀頂面與工具中心線具-50°的大後斜角。如此設計，可使球型研削工具上的微細鑽石切刃與碳化鎢模仁均承受壓應力，免於脆性破壞。為預防球型研削工具中心點因研削速度為0，而發生的擠壓破壞，研削工具刀頂面設計以跨越工具中心線，以避免靜態擠壓。球型研削工具採線上線切割放電成形，亦即球型研削工具被加工與球型研削工具加工碳化鎢模仁的過程中，研削工具均不拆卸，以便維持其最高同心精度，且可省卻繁複校正時間。而碳化鎢模仁以高速快淺研削技術及浸油對流方式，進行研削創成，實驗結果顯示，無論是微小溝槽或微小陣列式非球面模穴的加工，均可獲致高形狀精度與良好的表面性狀，微溝及非球面模穴的表面粗糙度分別達Ra 112 nm與1.29 µm。顯示本研究開發的精微含硼精微聚晶鑽石球型研削工具，能成功應用於精微非球面碳化鎢模仁的開發製作，其製程所需成本低、環保且加工精度高，未來可應用於照明等級的精微透鏡產業應用。

    The primary purpose of the thesis is to develop a micro BD-PCD ball grinding tool with a large negative-back-rake-angle and using the finished tool to generate micro tungsten carbide die array. The BD-PCD substrate with diamond grit of 10-15 µm is first welded onto a WC shank by means of high-frequency silver brazing. Subsequently, the micro BD-PCD ball grinding tool is formed by rotary wire Electrical Discharge Machining (RWEDM). To prevent the occurrence of squeeze failure between the tool and die, the negative-back-rake-angle of the tool is designed up to -50° whereby the diamond grain and WC die can all bear uniform compression stress. In addition, the tool face is schemed with crossing the center line of tool so as to avoid squeeze effect occurs at the center of the free end of the tool due to it being devoid of cutting speed. The developed grinding tool is used to grind WC die using an in-situ HSFSG (High-Speed & Fast-Shallow Grinding) technique. Generating the aspheric micro die array in-situ saves a lot of time and fiddly pre-processing in the development of micro molds. Experimental results demonstrate that the micro aspheric die array with high dimensional and geometrical accuracy can be achieved successfully. The surface roughness of the microgroove and die-cavity is down to Ra 112 nm and 1.29 µm, respectively. The BD-PCD ball grinding tool is evaluated and discussed with regard to thermal machinability, graphitizing of diamond, orientation of spark erosion and wear processes as well as life expectancy. It is expected that the techniques used in the development of micro die array in WC should contribute greatly to the field of precision optoelectronic industry.

    中文摘要 i 英文摘要 ii 誌謝 iii 目錄 iv 表目錄 viii 圖目錄 x 符號說明 xv 第一章 緒論 1 1.1 前言 1 1.2 研究動機 2 1.3 研究目的 4 1.4 研究方法 4 1.5 文獻回顧 6 1.5.1 鑽石刀具開發與應用現況 6 1.5.2 微小模具開發現況 10 第二章 聚晶鑽石研削工具製作原理與應用 17 2.1 放電加工原理 17 2.1.1 精微雕模放電加工原理 18 2.1.2 精微線切割放電加工原理 19 2.2 BD-PCD導電原理 20 2.3 高週波焊接原理 21 2.4 高速快淺研削原理 22 2.4.1 研削基本原理 23 2.4.2 硬脆材料研削移除機制 25 2.4.3 高速快淺研削原理應用 26 2.5 聚晶鑽石刀具之溶蝕與銳化 27 第三章 實驗設備與設計 29 3.1 CNC線切割放電加工機應用 29 3.2 高速主軸應用 29 3.3 導電迴路設計 30 3.4 CNC立式綜合加工機應用 31 3.5 高剛性桌上型工具機應用 32 3.6 軟體應用 33 3.6.1 非球面產生器 33 3.6.2 電腦輔助製造(CAM) 34 3.7 量測設備 35 3.7.1 工具顯微鏡 35 3.7.2 掃描式電子顯微鏡 36 3.7.3 3D雷射共焦顯微鏡 36 3.7.4 表面形狀量測儀 37 3.7.5 拉曼光譜儀 37 3.8 實驗材料 38 3.8.1 含硼聚晶鑽石(BD-PCD) 38 3.8.2 銅線電極 39 3.8.3 拋光用鑽石膏 40 3.8.4 模具基材-P類碳化鎢 40 第四章 實驗方法 41 4.1 精微聚晶鑽石球型研削工具設計與開發 42 4.1.1 精微聚晶鑽石球型研削工具設計與分析 43 4.1.2 放電切割方向對研削工具成形的影響 44 4.1.3 放電間隙補償對研削工具成形的影響 46 4.1.4 放電週期對研削工具成形的影響 47 4.1.5 放電能量對研削工具成形的影響 49 4.1.6 精微聚晶鑽石球型研削工具開發驗證 50 4.2 切削阻力對高硬度材料加工的影響 54 4.2.1 精微聚晶鑽石半球型研削工具設計與分析 55 4.2.2 刀具形狀對研削阻力的影響 58 4.2.3 刀具進給方向對研削阻力的影響 59 4.2.4 切削劑對研削阻力及模具面粗度的影響 61 4.3 BD-PCD刀具磨耗、填塞與變質層探討 68 4.3.1 BD-PCD研削工具磨耗探討 68 4.3.2 BD-PCD研削工具填塞與銳化 70 4.3.3 聚晶鑽石刀具之石墨化 72 第五章 碳化鎢微小模仁之研削創成驗證 74 5.1 微細溝槽研銑創成實驗 74 5.1.1 研削速度對模仁表面粗糙度的影響 74 5.1.2 研銑進給率對表面粗糙度的影響 78 5.1.3 研銑深度對模仁表面粗糙度的影響 81 5.1.4 微細溝槽研削創成驗證 84 5.2 非球面陣列模仁創成實驗 86 5.2.1 非球面微透鏡模仁設計與開發 87 5.2.2 非球面模仁研削路徑選用 89 5.2.3 進給率對非球面模仁表面粗糙度的影響 90 5.2.4 Z軸補正對非球面模具形狀精度的影響 92 5.2.5 非球面陣列模仁設計與開發驗證 94 第六章 結論與未來展望 98 6.1 結論 98 6.2 未來展望 101 參考文獻 102 作者簡歷 I

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